Silicone Resin for Electronics Encapsulation (RH-5803 Series)

Encapsulation Resin

Silicone Resin for Electronics Encapsulation (RH-5803 Series)RH-5803 / 5803-1 / 5803-2 / 5803-3
Silicone Resin

Overview

Series of methyl-phenyl silicone resins (5803, 5803-1, 5803-2, 5803-3) differing in phenyl content and viscosity. Used for LED encapsulation, electronic potting, and high-temperature adhesives. Excellent transparency and refractive index tunability.

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Key Features

  • Four grades: 5803, 5803-1, 5803-2, 5803-3
  • Tunable refractive index
  • Excellent transparency
  • Thermal stability >200 °C
  • Low shrinkage on cure

Applications

  • LED encapsulation
  • Electronic potting and conformal coatings
  • High-temperature adhesives
  • Optical bonding

Technical Snapshot

Product CodeRH-5803 / 5803-1 / 5803-2 / 5803-3
CategoryElectronic Encapsulation Resin
SubcategoryEncapsulation Resin
Cure System
Packaging5 kg or 25 kg drum

Full technical data (TDS) and safety data (SDS) sheets are available on request. Detailed hardness, viscosity and mechanical parameters are provided during quotation.

Solution Positioning

Customizable silicone encapsulant series for electronic and optoelectronic manufacturers.

Served Industries

  • LED & Lighting
  • Electronics Potting
  • Optical Bonding
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